Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

This book provides the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, the book addresses the use of solder alloys, sintered silver, and copper, and transient liquid phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while still providing comprehensive coverage of the more widespread techniques employing solder alloys. Comprehensively addresses both sintering and soldering, thereby comprehensively addressing principles, methods, and performance of high-temperature die-attach materials; Emphasizes the industrial perspective with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials and equipment suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.